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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Frequency Taconic PCB Board 0.8mm Thickness In HASL - LF Finished Surface

Shenzhen Xinchenger Electronic Co.,Ltd
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High Frequency Taconic PCB Board 0.8mm Thickness In HASL - LF Finished Surface

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Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Taconic

Layer : 2

Color : Black

Min line space : 5mil

Min line width : 5mil

Copper thickness : 1OZ

Board size : 200*75mm

Panel : 1

Surface : HASL-LF

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High Frequency Taconic PCB Board 0.8mm Thickness In HASL - LF Finished Surface



Quick detail:

Origin:ChinaSpecial: High frequency pcb
Layer:2Thickness:0.79mm
Surface: HASL-LFHole:0.8



Introduction:

The increasing complexity of electronic components and switches continually requires faster
signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times
in electronic components, it has also become necessary for high frequency (HF) technology to
view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that the
impedance (dynamic resistance) varies with respect to the sending component. To prevent such
capacitive effects, all parameters must be exactly specified, and implemented with the highest level
of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace
geometry,the layer buildup, and the dielectric constant (er) of the materials used.


Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

High-frequency circuit board includes a hollow core plate provided with grooves and glue to flow through the upper and lower surfaces of the CCL on the core plate, the upper opening of the hollow groove and a lower opening edge with a wall.


Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • low dielectric loss
  • RF Identification (RFID) Tags
  • The stability of the dielectric constant
  • An extremely low water imbibition
  • LNB’s for Direct Broadcast Satellites

Taconic Advanced Dielectric branch provides PTFE / woven glass fiber cloth sheet of microwave, radio frequency (RF) and high-speed digital signal processing market. This material can be applied to LNAs, LNBs, PCS / PCN antenna system, global positioning system (GPS) and UMTS antenna system, and a power amplifier, passive components, collision avoidance radar systems, aviation technology and remote assistant director phased array radar system.


Parameter:

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling



Features


• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program


Rogers material in stock:

BrandModelThickness(mm)DK(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO40030.254 0.508,0.813,1.5243.38
RO43500.254 0.508,0.762,1.5243.5
RO58800.254.0.508.0.7622.2
RO30030.127,0.508,0.762,1.5243
RO30100.63510.2
RO32060.635MM10.2
R030350.508MM3.5
RO60100.635MM, 1,27MM10.2

Company:

Company spirit:Customer first,openness basing on sincerity.

Comapny culture:Improve employees quality with on the job training.

Quality policy:Honesty,superior quality,high efficiency.

Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
















































































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