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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Rogers 2 Layer Double Sided PCB Prototype Board Multi - Layer for Communication Systems

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Rogers 2 Layer Double Sided PCB Prototype Board Multi - Layer for Communication Systems

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Brand Name : XCE

Model Number : XCEP

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Layer of number : 2-40

Surface finish : Immersion gold

Base material : rogers

Panel : 4*2

Board THK : 0.508mm

Product name : multilayer pcb

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RF PCB Rogers Prototype Multi - Layer for Communication Systems ​

RF Rogers printed circuit boards can provide a variety of benefits to the user and to the application:

  • Low cost fabrication
  • Controlled impedance
  • Range of dielectric constants
  • Low signal and dielectric loss
  • Optimized cost and high RF performance
  • Compatible with lead-free solder processing
  • Can also be used with FR-4 fabrication and multilayer PCBs
  • High thermal conductivity and improved thermal management

Specification:

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 2-40
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance　　 T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness　　 ＞0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance ＞1012Ωnormal
Through-hole resistance ＜300Ωnormal
Electric strength ＞1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity ＞6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Applications:

  • Station antennas
  • Power amplifiers
  • Military radar systems
  • Missile guidance systems
  • Direct broadcast satellites
  • Space satellite transceivers
  • Automotive radar and sensors
  • Air and ground based radar systems
  • Global positioning satellite antennas
  • Cellular telecommunications systems
  • Wireless communications patch antennas


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China Rogers 2 Layer Double Sided PCB Prototype Board Multi - Layer for Communication Systems factory

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